Invention Grant
- Patent Title: High-frequency module
- Patent Title (中): 高频模块
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Application No.: US13749954Application Date: 2013-01-25
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Publication No.: US09071227B2Publication Date: 2015-06-30
- Inventor: Takanori Uejima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co. Ltd.
- Current Assignee: Murata Manufacturing Co. Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-167654 20100727
- Main IPC: H03H9/72
- IPC: H03H9/72 ; H03H7/42 ; H04B1/48 ; H04B1/00 ; H04B1/04 ; H04B1/18 ; H03H1/00 ; H03H7/01

Abstract:
A high-frequency module has a structure including balanced terminals, with high design flexibility and good transmission characteristics. Wiring patterns to be connected to balanced terminals of SAW filters of SAW duplexers are located on a second layer to a sixth layer of a layered body. The characteristic impedances of first wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of second wiring patterns defining a pair of parallel or substantially parallel lines match, the characteristic impedances of third wiring patterns defining a pair of parallel or substantially parallel lines match, and the characteristic impedances of fourth wiring patterns defining a pair of parallel or substantially parallel lines match.
Public/Granted literature
- US20130141180A1 HIGH-FREQUENCY MODULE Public/Granted day:2013-06-06
Information query
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