Invention Grant
- Patent Title: Process for fabricating a three dimensional molded feed structure
- Patent Title (中): 用于制造三维模制进料结构的方法
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Application No.: US12620562Application Date: 2009-11-17
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Publication No.: US09072164B2Publication Date: 2015-06-30
- Inventor: Alberto F. Viscarra , David T. Winslow , Billy D. Ables , Kurt S. Ketola , Kurt J. Krause , Kevin C. Rolston , Rohn Sauer , James R. Chow
- Applicant: Alberto F. Viscarra , David T. Winslow , Billy D. Ables , Kurt S. Ketola , Kurt J. Krause , Kevin C. Rolston , Rohn Sauer , James R. Chow
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Christie, Parker & Hale, LLP
- Main IPC: H01R43/00
- IPC: H01R43/00 ; H05K3/00 ; H01Q21/00 ; H05K1/03 ; H05K3/06 ; H05K3/38
Abstract:
A process for fabricating a three dimensional molded feed structure is provided. In one embodiment, the invention relates to a process for fabricating a three dimensional radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a first preselected pattern of channels in the flexible circuit substrate, depositing a conductive layer on the formed flexible substrate, and removing portions of the conductive layer to form a plurality of conductive traces.
Public/Granted literature
- US20110113619A1 PROCESS FOR FABRICATING A THREE DIMENSIONAL MOLDED FEED STRUCTURE Public/Granted day:2011-05-19
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