Invention Grant
- Patent Title: Stacked-type multilayer ceramic electronic component, stacked-type multilayer ceramic electronic component module, and method of manufacturing the same
- Patent Title (中): 叠层型多层陶瓷电子部件,层叠型多层陶瓷电子部件模块及其制造方法
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Application No.: US13842121Application Date: 2013-03-15
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Publication No.: US09072178B2Publication Date: 2015-06-30
- Inventor: Hae Sock Chung , Doo Young Kim , Na Rim Ha , Youn Sik Jin , Tae Ok Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon, Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon, Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2012-0142918 20121210
- Main IPC: H01G4/228
- IPC: H01G4/228 ; H05K1/02 ; H01G4/12 ; H05K1/18 ; H01G4/30 ; H01G4/38

Abstract:
There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.
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