Invention Grant
US09072178B2 Stacked-type multilayer ceramic electronic component, stacked-type multilayer ceramic electronic component module, and method of manufacturing the same 有权
叠层型多层陶瓷电子部件,层叠型多层陶瓷电子部件模块及其制造方法

Stacked-type multilayer ceramic electronic component, stacked-type multilayer ceramic electronic component module, and method of manufacturing the same
Abstract:
There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance.
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