Invention Grant
- Patent Title: Substrate unit
- Patent Title (中): 基板单元
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Application No.: US13983832Application Date: 2011-03-16
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Publication No.: US09072189B2Publication Date: 2015-06-30
- Inventor: Hajime Kosugi , Ken Asakura
- Applicant: Hajime Kosugi , Ken Asakura
- Applicant Address: JP Aichi-ken
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Aichi-ken
- Agency: Sughrue Mion, PLLC
- International Application: PCT/JP2011/056209 WO 20110316
- International Announcement: WO2012/124074 WO 20120920
- Main IPC: H05K7/12
- IPC: H05K7/12 ; H05K7/14 ; H05K9/00

Abstract:
A substrate unit includes a conductive case, an insulating case arranged in the conductive case, a first screw member having conductivity, arranged in the conductive case and fixing the insulating case to an inner wall surface of the conductive case, a circuit substrate provided opposite to the inner wall surface with respect to the insulating case and fixed to the insulating case, and a second screw member having conductivity and fixing the circuit substrate to the insulating case. The first screw member and the second screw member are screwed in toward the inner wall surface. The first screw member and the second screw member are spaced from each other. The first screw member and the second screw member are connected to each other with a connecting member having conductivity.
Public/Granted literature
- US20130308257A1 SUBSTRATE UNIT Public/Granted day:2013-11-21
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