Invention Grant
- Patent Title: Method for forming a conductive pattern
- Patent Title (中): 形成导电图案的方法
-
Application No.: US13917946Application Date: 2013-06-14
-
Publication No.: US09072209B2Publication Date: 2015-06-30
- Inventor: Israel Schuster
- Applicant: Eastman Kodak Company
- Applicant Address: US NY Rochester
- Assignee: EASTMAN KODAK COMPANY
- Current Assignee: EASTMAN KODAK COMPANY
- Current Assignee Address: US NY Rochester
- Agency: Nelson Adrian Blish
- Main IPC: C23C18/54
- IPC: C23C18/54 ; H05K3/46 ; C23C18/18 ; C23C18/16 ; C23C18/20 ; C23C18/30 ; C23C18/32 ; C23C18/38 ; C23C18/42

Abstract:
A method for forming a conductive pattern on a substrate (208) includes providing an image pattern for imaging on the substrate; imaging the image pattern on the substrate creating imaged areas; spraying functional material (240) on the substrate that diffuse molecules of the functional material into the imaged areas and wherein the functional material is in a form of liquid; and applying electro-less copper coating that builds conductive material traces on the imaged areas on the substrate.
Public/Granted literature
- US20140370185A1 METHOD FOR FORMING A CONDUCTIVE PATTERN Public/Granted day:2014-12-18
Information query
IPC分类: