Invention Grant
- Patent Title: Modular hook plate assembly
- Patent Title (中): 模块化钩板组件
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Application No.: US13369905Application Date: 2012-02-09
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Publication No.: US09072557B2Publication Date: 2015-07-07
- Inventor: Johann Fierlbeck , Alfred Niederberger
- Applicant: Johann Fierlbeck , Alfred Niederberger
- Applicant Address: US MA Raynham
- Assignee: DEPUY SYNTHES PRODUCTS, INC.
- Current Assignee: DEPUY SYNTHES PRODUCTS, INC.
- Current Assignee Address: US MA Raynham
- Agency: Fay Kaplun & Marcin, LLP
- Main IPC: A61B17/80
- IPC: A61B17/80

Abstract:
A hook plate assembly includes a bone plate extending along a longitudinal axis from a first end to a second end and including an upper surface facing away from a bone, a bone contacting surface, a plate hole extending therethrough from the upper surface to the bone contacting surface and a connection section arranged at the second end. The plate hole is sized and shaped to receive a bone fixation element therethrough in combination with a hook including a connecting portion configured to connect the hook to the connection section of the bone plate and a fastening element releasably coupling the hook to the bone plate.
Public/Granted literature
- US20130041375A1 Modular Hook Plate Assembly Public/Granted day:2013-02-14
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