Invention Grant
- Patent Title: Active implantable device
- Patent Title (中): 主动植入装置
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Application No.: US13068974Application Date: 2011-05-25
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Publication No.: US09072908B2Publication Date: 2015-07-07
- Inventor: Heiko Specht , Andreas Reisinger , Klaus Ruppert , Alfred Hohmann
- Applicant: Heiko Specht , Andreas Reisinger , Klaus Ruppert , Alfred Hohmann
- Applicant Address: DE Hanau
- Assignee: Heraeus Precious Metals GmbH & Co. KG
- Current Assignee: Heraeus Precious Metals GmbH & Co. KG
- Current Assignee Address: DE Hanau
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: DE102010021381 20100525; DE102011016702 20110411
- Main IPC: B32B1/02
- IPC: B32B1/02 ; A61N1/00 ; B29C65/00 ; B32B27/00 ; A61N1/375 ; C09J4/06 ; C08J5/00 ; C09J133/08
Abstract:
One aspect relates to a method for connecting a housing of an active implantable medical device to a head part, whereby an uncured joining agent that is arranged, at least in part, between the housing and the head part is transitioned into a cured joining agent to attain a firmly bonded connection. In one embodiment, the uncured joining agent includes monomers of a (meth)acrylic acid alkyl ester, and the cured joining agent includes at least one polymer of the (meth)acrylic acid alkyl ester.
Public/Granted literature
- US20110293866A1 Active implantable device Public/Granted day:2011-12-01
Information query
