Invention Grant
- Patent Title: Method for manufacturing a component by selective laser melting
- Patent Title (中): 通过选择性激光熔化制造部件的方法
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Application No.: US13813968Application Date: 2011-07-20
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Publication No.: US09073150B2Publication Date: 2015-07-07
- Inventor: Andreas Graichen
- Applicant: Andreas Graichen
- Applicant Address: DE München
- Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee: SIEMENS AKTIENGESELLSCHAFT
- Current Assignee Address: DE München
- Priority: EP10008192 20100805
- International Application: PCT/EP2011/062457 WO 20110720
- International Announcement: WO2012/016836 WO 20120209
- Main IPC: B23P6/00
- IPC: B23P6/00 ; B23K26/30 ; B22F9/24 ; B23K26/08 ; B23K26/34 ; H05B6/10 ; B23K26/32
Abstract:
A method of manufacturing a component by selective laser melting and to provide heat treatment to the component is provided. The method includes building a heat treatment device adapted to provide a heat treatment to the component as part of the same selective laser melting for manufacturing the component and providing a heat treatment to the component by the heat treatment device.
Public/Granted literature
- US20130199013A1 METHOD FOR MANUFACTURING A COMPONENT BY SELECTIVE LASER MELTING Public/Granted day:2013-08-08
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