Invention Grant
- Patent Title: Apparatus and method for testing printed circuit board
- Patent Title (中): 印刷电路板测试装置及方法
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Application No.: US14261444Application Date: 2014-04-25
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Publication No.: US09073212B2Publication Date: 2015-07-07
- Inventor: Yong Li , Xi-Song Shuai , Yun-Qing Liu
- Applicant: Fu Tai Hua Industry (Shenzhen) Co., Ltd. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: Fu Tai Hua Industry (Shenzhen) Co., Ltd.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201310201465 20130527
- Main IPC: B25J9/16
- IPC: B25J9/16 ; H01L21/66 ; H01L21/677

Abstract:
A printed circuit board testing method includes determining a position of a robot at a predetermined time interval and determining whether the determined position of the robot is within a preset position range. The method determines whether one or more shielding boxes are open according to unique identifiers of the shielding boxes stored in a storage system when the determined position of the robot is within the preset position range. The method obtains a predetermined path of each determined open shielding box from the storage system when one or more shielding boxes are open. The method further determines a shortest predetermined path among the obtained predetermined paths, and transmits a control signal including the determined predetermined path to the robot.
Public/Granted literature
- US20140350769A1 APPARATUS AND METHOD FOR TESTING PRINTED CIRCUIT BOARD Public/Granted day:2014-11-27
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