Glass articles for use as covers in electronic devices and methods for forming the same are described herein. The glass articles generally include a shaped glass substrate comprising a first face, a second face and a perimeter edge. The shaped glass substrate may be formed from strengthened glass such that the shaped glass substrate has a compressive stress layer which improves the ability of the glass article to withstand surface damage without cracking. A polymer overmold is coupled to the attachment feature of the perimeter edge of the shaped glass substrate thereby protecting the perimeter edge of the shaped glass substrate from damage. In one embodiment, at least a portion of the perimeter edge of the shaped glass substrate comprises an attachment feature offset from the first face. In another embodiment the polymer overmold is integrally formed with at least one connector.