Invention Grant
- Patent Title: Disposable bond gap control structures
- Patent Title (中): 一次性债券差距控制结构
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Application No.: US13905431Application Date: 2013-05-30
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Publication No.: US09073298B2Publication Date: 2015-07-07
- Inventor: Buu Diep , Roland Gooch
- Applicant: Raytheon Company
- Applicant Address: US MA Waltham
- Assignee: RAYTHEON COMPANY
- Current Assignee: RAYTHEON COMPANY
- Current Assignee Address: US MA Waltham
- Agency: Daly, Crowley, Mofford & Durkee, LLP
- Main IPC: B32B37/02
- IPC: B32B37/02 ; B32B38/10 ; B32B37/30 ; B81C3/00 ; B32B37/00 ; B81C1/00
Abstract:
In certain embodiments, a bond gap control structure (BGCS) is placed outwardly from a substrate. The BGCS is configured to control a geometry of a bond line of a joining material. The joining material is deposited outwardly from the substrate. The substrate is bonded to another substrate with the joining material. The BGCS is at least partially removed from the substrate.
Public/Granted literature
- US20130255876A1 DISPOSABLE BOND GAP CONTROL STRUCTURES Public/Granted day:2013-10-03
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