Invention Grant
- Patent Title: Liquid ejecting head module and liquid ejecting apparatus
- Patent Title (中): 液体喷射头模块和液体喷射装置
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Application No.: US14222476Application Date: 2014-03-21
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Publication No.: US09073334B2Publication Date: 2015-07-07
- Inventor: Hiroyuki Hagiwara , Hiroshige Owaki , Katsuhiro Okubo
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: JP2013-065813 20130327
- Main IPC: B41J2/175
- IPC: B41J2/175 ; B41J2/155

Abstract:
A unit head has an inlet section that introduces ink from a side of a sub-tank through a porous member. The sub-tank has a pressure control section corresponding to each unit head, individually, and has an outlet section that delivers the ink from the pressure control section through a porous member. The pressure control section has a valve and a film that is displaced in response to a pressure change. The film is provided in an upper surface of the sub-tank. A frame has an inlet-side connection section to which the outlet section of the sub-tank is connected, an outlet-side connection section to which the inlet section of the unit head is connected, and a communication flow path that communicates with both connection sections. Both of the connection sections include porous members, and supply and receive the ink by a surface contact of the porous members with each other.
Public/Granted literature
- US20140292933A1 LIQUID EJECTING HEAD MODULE AND LIQUID EJECTING APPARATUS Public/Granted day:2014-10-02
Information query
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