Invention Grant
- Patent Title: Tape connecting apparatus
- Patent Title (中): 胶带连接装置
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Application No.: US13888391Application Date: 2013-05-07
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Publication No.: US09073719B2Publication Date: 2015-07-07
- Inventor: Jay Cheng , Linsen Kong
- Applicant: Wistron Corporation
- Applicant Address: TW Hsichih, New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Hsichih, New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: CN201310109027 20130329
- Main IPC: B25B1/22
- IPC: B25B1/22 ; B23Q3/00 ; B25B27/00 ; B65H21/00

Abstract:
A tape connecting apparatus for connecting a brass buckle to remaining and unused tapes, includes a support base, a platform, a support pillar, and a clamp device including a tape connecting base and a tape connecting clamp. The platform is disposed on the support base. The support pillar rotatably stands on the platform. The tape connecting base is detachably disposed at a top end of the support pillar. The tape connecting clamp has upper and lower handles respectively pivoted to the tape connecting base. The upper handle has a clamp head and is pivoted to the lower handle. When the brass buckle, the remaining tape and the unused tape are positioned on the tape connecting base, the upper and lower handles are rotated relatively to drive the clamp head to press the brass buckle, so that the unused tape could be connected to the remaining tape via the brass buckle.
Public/Granted literature
- US20140290046A1 TAPE CONNECTING APPARATUS Public/Granted day:2014-10-02
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