Invention Grant
- Patent Title: Microelectro mechanical system encapsulation scheme
- Patent Title (中): 微电机械系统封装方案
-
Application No.: US13293917Application Date: 2011-11-10
-
Publication No.: US09073748B2Publication Date: 2015-07-07
- Inventor: Bruce C. S. Chou , Chen-Chih Fan
- Applicant: Bruce C. S. Chou , Chen-Chih Fan
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Lowe Hauptman & Ham, LLP
- Main IPC: H01L29/84
- IPC: H01L29/84 ; B81B7/00 ; H01L23/31
Abstract:
A microelectro mechanical system (MEMS) assembly includes a carrier and a MEMS device disposed over the carrier. A buffer layer is disposed over the MEMS device. The Young's modulus of the buffer layer is less than that of the MEMS device.
Public/Granted literature
- US20130119493A1 MICROELECTRO MECHANICAL SYSTEM ENCAPSULATION SCHEME Public/Granted day:2013-05-16
Information query
IPC分类:
