Invention Grant
US09074033B2 Ethylene/tetrafluoroethylene copolymer, electrical wire, and fluorine resin powder for rotational molding
有权
乙烯/四氟乙烯共聚物,电线和用于旋转成型的氟树脂粉末
- Patent Title: Ethylene/tetrafluoroethylene copolymer, electrical wire, and fluorine resin powder for rotational molding
- Patent Title (中): 乙烯/四氟乙烯共聚物,电线和用于旋转成型的氟树脂粉末
-
Application No.: US13265395Application Date: 2010-04-20
-
Publication No.: US09074033B2Publication Date: 2015-07-07
- Inventor: Takayuki Hirao , Kenji Ichikawa , Shigehito Sagisaka , Yumi Nakano
- Applicant: Takayuki Hirao , Kenji Ichikawa , Shigehito Sagisaka , Yumi Nakano
- Applicant Address: JP Osaka
- Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee: DAIKIN INDUSTRIES, LTD.
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2009-103351 20090421
- International Application: PCT/JP2010/057009 WO 20100420
- International Announcement: WO2010/123002 WO 20101028
- Main IPC: D02G3/00
- IPC: D02G3/00 ; H01B3/44 ; C08F214/26 ; H01B7/29

Abstract:
The present invention provides an ethylene/tetrafluoroethylene copolymer showing good heat resistance and good crack resistance even in a high temperature environment. The present invention is an ethylene/tetrafluoroethylene copolymer, comprising: copolymerization units derived from ethylene; tetrafluoroethylene; and a fluorine-containing vinyl monomer represented by general formula: CH2═CH—Rf in the formula, Rf representing a perfluoroalkyl group containing four or more carbon atoms, a fluorine-containing vinyl monomer content being 0.8 to 2.5 mol % to a total amount of all monomers, an ethylene/tetrafluoroethylene molar ratio being 33.0/67.0 to 44.0/56.0, a CH index being 1.40 or less, a melting point being 230° C. or higher, and a melt flow rate being 40 (g/10 minutes) or less.
Public/Granted literature
Information query