Invention Grant
- Patent Title: Thermosetting resin composition, thermosetting resin composition for fiber-reinforced composite material, prepared using the same, and honeycomb sandwich panel
- Patent Title (中): 热固性树脂组合物，使用其制备的纤维增强复合材料用热固性树脂组合物和蜂窝夹层板
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Application No.: US13498074Application Date: 2010-09-22
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Publication No.: US09074091B2Publication Date: 2015-07-07
- Inventor: Masayuki Kawazoe , Tomohiro Ito , Mitsuhiro Iwata
- Applicant: Masayuki Kawazoe , Tomohiro Ito , Mitsuhiro Iwata
- Applicant Address: JP
- Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee: The Yokohama Rubber Co., LTD.
- Current Assignee Address: JP
- Agency: Thorpe North & Western
- Priority: JP2009-221057 20090925; JP2009-231446 20091005
- International Application: PCT/JP2010/066425 WO 20100922
- International Announcement: WO2011/037144 WO 20110331
- Main IPC: B32B27/20
- IPC: B32B27/20 ; B32B27/04 ; B32B27/38 ; C08K5/06 ; C08K5/41 ; C08K9/12 ; C08L63/00 ; C08L81/06 ; C08J5/24 ; C08L79/08
Abstract:
An object of the present invention is to provide a thermosetting resin composition having superior toughness. The thermosetting resin composition of the present invention includes a thermosetting resin, and an adsorbing filler in which a thermoplastic resin C is adsorbed on a filler, wherein an adsorption coefficient that is greater than 0 and less than or equal to 0.8, defined by Formula 1 is satisfied. Formula 1: Adsorption coefficient={Amount (parts by mass) of the thermoplastic resin C adsorbed on 100 parts by mass of the filler/specific gravity of the thermoplastic resin C}/DBP oil absorption (mL/100 g) of the filler.
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