Invention Grant
- Patent Title: Light emitting diode package
- Patent Title (中): 发光二极管封装
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Application No.: US14230352Application Date: 2014-03-31
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Publication No.: US09074735B2Publication Date: 2015-07-07
- Inventor: Chen-Hsiu Lin , Chia-Hao Wu
- Applicant: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. , LITE-ON TECHNOLOGY CORPORATION
- Applicant Address: CN Changzhou, Jiangsu Province TW Taipei
- Assignee: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.,LITE-ON TECHNOLOGY CORPORATION
- Current Assignee: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.,LITE-ON TECHNOLOGY CORPORATION
- Current Assignee Address: CN Changzhou, Jiangsu Province TW Taipei
- Agency: Li & Cai Intellectual Property (USA) Office
- Priority: CN201310115957 20130403
- Main IPC: H01L33/00
- IPC: H01L33/00 ; F21K99/00 ; H01L33/60 ; H01L33/40 ; H01L33/10 ; H01L33/48 ; F21Y101/02 ; F21Y105/00
Abstract:
A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip.
Public/Granted literature
- US20140299894A1 LIGHT EMITTING DIODE PACKAGE Public/Granted day:2014-10-09
Information query
IPC分类:
