A low-profile heat transfer device includes a main body and at least one wick structure. The main body extends from a first end to a second end and defines an inner space, in which the wick structure is provided. The wick structure also extends from the first end toward the second end, such that at least one channel is defined in the inner space by the main body and the wick structure. The low-profile heat transfer device can be flexibly designed into any desired shape according to actual need, and is able to absorb heat from a heat-producing element and quickly transfer the absorbed heat to a distant location for dissipation, and therefore enables highly efficient vapor-liquid circulation therein and allows an electronic device to have excellent heat dissipation efficiency.