Invention Grant
- Patent Title: Heatsink apparatus and electronic device having the same
- Patent Title (中): 散热装置和具有该散热装置的电子装置
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Application No.: US12239186Application Date: 2008-09-26
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Publication No.: US09074825B2Publication Date: 2015-07-07
- Inventor: Kaoru Satou , Haruhiko Kouno
- Applicant: Kaoru Satou , Haruhiko Kouno
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Berstein, P.L.C.
- Priority: JP2007-254040 20070928; JP2007-254044 20070928
- Main IPC: F28D15/02
- IPC: F28D15/02 ; G06F1/20 ; H01L23/427

Abstract:
A heatsink apparatus performs cooling by circulating a working fluid and causing a phase change between a liquid phase and a gas phase. The heatsink apparatus is provided on an external wall with a heat-generating body. The heatsink apparatus includes a box-shaped heat-receiving unit transferring heat to a heat-receiving plate; an inlet pipe supplying the working fluid to the heat-receiving unit; an outlet pipe discharging vapors into which the working fluid supplied to the heat-receiving plate is evaporated by heat; and a heat dissipater provided at a location higher than the heat-receiving unit and dissipating heat of the vapor passing through the outlet pipe. Slits are provided to the heat-receiving plate on a surface surrounded by an external circumference of the inlet pipe toward outside of the heat-receiving plate.
Public/Granted literature
- US20090084525A1 HEATSINK APPARATUS AND ELECTRONIC DEVICE HAVING THE SAME Public/Granted day:2009-04-02
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