Invention Grant
- Patent Title: Spectroscopy module and manufacturing method therefor
- Patent Title (中): 光谱模块及其制造方法
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Application No.: US13390527Application Date: 2010-08-11
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Publication No.: US09075193B2Publication Date: 2015-07-07
- Inventor: Katsumi Shibayama , Takafumi Yokino
- Applicant: Katsumi Shibayama , Takafumi Yokino
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2009-190340 20090819
- International Application: PCT/JP2010/063648 WO 20100811
- International Announcement: WO2011/021557 WO 20110224
- Main IPC: G01J3/28
- IPC: G01J3/28 ; G02B5/18 ; G01J3/02 ; G01J3/18

Abstract:
In a spectroscopic module 1, a flange 7 is formed integrally with a diffraction layer 6 along a periphery thereof so as to become thicker than the diffraction layer 6. As a consequence, at the time of releasing a master mold used for forming the diffraction layer 6 and flange 7, the diffraction layer 6 formed along a convex curved surface 3a of a main unit 3 can be prevented from peeling off from the curved surface 3a together with the master mold. A diffraction grating pattern 9 is formed so as to be eccentric with respect to the center of the diffraction layer 6 toward a predetermined side. Therefore, releasing the mold earlier from the opposite side of the diffraction layer 6 than the predetermined side thereof can prevent the diffraction layer 6 from peeling off and the diffraction grating pattern 9 from being damaged.
Public/Granted literature
- US20120140214A1 SPECTROSCOPY MODULE AND MANUFACTURING METHOD THEREFOR Public/Granted day:2012-06-07
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