Invention Grant
- Patent Title: Method for assembling a photoelectric conversion module
- Patent Title (中): 组装光电转换模块的方法
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Application No.: US11700792Application Date: 2007-02-01
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Publication No.: US09075208B2Publication Date: 2015-07-07
- Inventor: Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi
- Applicant: Osamu Daikuhara , Yuko Ohse , Shigeyuki Takizawa , Toshio Hashi
- Applicant Address: JP Tokyo
- Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee: FUJITSU COMPONENT LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2006-186883 20060706; JP2006-186884 20060706; JP2006-186885 20060706
- Main IPC: H05K3/30
- IPC: H05K3/30 ; G02B6/42
Abstract:
A method of assembling a photoelectric conversion module is disclosed. The photoelectric conversion module includes a circuit board on which are mounted a light emitting element, a light receiving element, and an optical element optically connected to the light emitting element and the light receiving element. The light emitting element is positioned on the circuit board based on a positioning mark formed on the circuit board beforehand. The light receiving element and the optical element are positioned based on a position of a light emission point of the light emitting element.
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