Invention Grant
US09075307B2 Photosensitive resin composition for protective film of printed wiring board for semiconductor package
有权
用于半导体封装的印刷电路板用保护膜的感光性树脂组合物
- Patent Title: Photosensitive resin composition for protective film of printed wiring board for semiconductor package
- Patent Title (中): 用于半导体封装的印刷电路板用保护膜的感光性树脂组合物
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Application No.: US13062038Application Date: 2009-08-28
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Publication No.: US09075307B2Publication Date: 2015-07-07
- Inventor: Kazuhiko Kurafuchi , Toshizumi Yoshino , Hideyuki Katagi , Masaya Ookawa , Yoshiaki Fuse
- Applicant: Kazuhiko Kurafuchi , Toshizumi Yoshino , Hideyuki Katagi , Masaya Ookawa , Yoshiaki Fuse
- Applicant Address: JP Tokyo
- Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee: HITACHI CHEMICAL COMPANY, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Griffin & Szipl, P.C.
- Priority: JPP2008-227156 20080904
- International Application: PCT/JP2009/065069 WO 20090828
- International Announcement: WO2010/026927 WO 20100311
- Main IPC: G03F7/028
- IPC: G03F7/028 ; G03F7/038 ; G03F7/004 ; H05K3/28
Abstract:
The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles.
Public/Granted literature
- US20110223539A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PROTECTIVE FILM OF PRINTED WIRING BOARD FOR SEMICONDUCTOR PACKAGE Public/Granted day:2011-09-15
Information query
IPC分类:
