Invention Grant
- Patent Title: Positive resist composition and patterning process
- Patent Title (中): 正抗蚀剂组成和图案化工艺
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Application No.: US13956533Application Date: 2013-08-01
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Publication No.: US09075308B2Publication Date: 2015-07-07
- Inventor: Jun Hatakeyama , Koji Hasegawa
- Applicant: Shin-Etsu Chemical Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee: SHIN-ETSU CHEMICAL CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2012-179141 20120813
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/039 ; G03F7/20

Abstract:
A positive resist composition comprises a polymer having a carboxyl group substituted with an acid labile group having formula (1) wherein R1 and R2 are alkyl or alkenyl, R3 and R4 are a single bond, methylene, ethylene or propylene, R5 and R6 are hydrogen or alkyl. The composition has a high dissolution contrast, high resolution, and suppressed acid diffusion rate, and forms a pattern of good profile and minimal edge roughness.
Public/Granted literature
- US20140045122A1 POSITIVE RESIST COMPOSITION AND PATTERNING PROCESS Public/Granted day:2014-02-13
Information query
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