A method for monitoring the temperatures of at least two semi-conductor power switches that are arranged on a common cooling body. Temperature detection is carried out by means of a temperature model each allocated to a switch, in which switch and operating parameters as well as temperature measurement values are processed for calculating the temperature and/or a temperature difference in the relevant switch. A temperature measurement value from a temperature sensor is used as an input parameter for the temperature model, the temperature sensor being centrally positioned between at least two switches and standing in a heat conducting connection with the cooling body. A related apparatus is an electronic temperature emitting power switch arrangement, having a temperature sensor positioned centrally between the two or between two switches each, the same being coupled in a heat conducting way with the cooling body and with the output side of the calculator.