Invention Grant
- Patent Title: Head assembly
- Patent Title (中): 头组件
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Application No.: US14619809Application Date: 2015-02-11
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Publication No.: US09076469B1Publication Date: 2015-07-07
- Inventor: Hideki Kuwajima , Taku Someya
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Main IPC: G11B5/48
- IPC: G11B5/48
Abstract:
A head assembly includes: a first link that is disposed to interconnect between a first joint connected to a slider support plate and a second joint connected to a first fixing unit; a second link that is disposed to interconnect between a third joint connected to the slider support plate and a fourth joint connected to a second fixing unit; a first drive unit that drives the first link; and a second drive unit that drives the second link.
Information query
IPC分类:
