Invention Grant
US09076518B2 Three-dimensional memory structures having shared pillar memory cells
有权
具有共享支柱存储单元的三维存储器结构
- Patent Title: Three-dimensional memory structures having shared pillar memory cells
- Patent Title (中): 具有共享支柱存储单元的三维存储器结构
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Application No.: US13365991Application Date: 2012-02-03
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Publication No.: US09076518B2Publication Date: 2015-07-07
- Inventor: Roy E. Scheuerlein , Eliyahou Harari
- Applicant: Roy E. Scheuerlein , Eliyahou Harari
- Applicant Address: US CA Milpitas
- Assignee: SanDisk 3D LLC
- Current Assignee: SanDisk 3D LLC
- Current Assignee Address: US CA Milpitas
- Agency: Vierra Magen Marcus LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; G11C13/00 ; G11C17/16 ; H01L27/24 ; H01L45/00

Abstract:
A three-dimensional non-volatile memory system is disclosed including a memory array utilizing shared pillar structures for memory cell formation. A shared pillar structure includes two non-volatile storage elements. A first end surface of each pillar contacts one array line from a first set of array lines and a second end surface of each pillar contacts two array lines from a second set of array lines that is vertically separated from the first set of array lines. Each pillar includes a first subset of layers that are divided into portions for the individual storage elements in the pillar. Each pillar includes a second subset of layers that is shared between both non-volatile storage elements formed in the pillar. The individual storage elements each include a steering element and a state change element.
Public/Granted literature
- US20120135580A1 Three-Dimensional Memory Structures Having Shared Pillar Memory Cells Public/Granted day:2012-05-31
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