Invention Grant
- Patent Title: Laminated ceramic electronic parts
- Patent Title (中): 层压陶瓷电子零件
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Application No.: US13650571Application Date: 2012-10-12
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Publication No.: US09076599B2Publication Date: 2015-07-07
- Inventor: Makoto Endo , Hirobumi Tanaka , Osamu Kido
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JP2011-226508 20111014; JP2012-156363 20120712
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/008

Abstract:
A compact laminated ceramic electronic component having superior moisture resistance and electrical properties is provided.A laminated ceramic electronic component 1 includes an inner layer portion that contains a plurality of dielectric layers 2a and internal electrode layers 3 comprising Ni as a main component that are laminated alternately, and a pair of dielectric outer layer portions 2b which sandwich the inner layer portions. And Ni particles are segregated in the dielectric outer layer portions 2b. And the amount of Ni particles existing in the dielectric layers 2a is smaller than that in the dielectric outer layer portions 2b.
Public/Granted literature
- US20130094121A1 LAMINATED CERAMIC ELECTRONIC PARTS Public/Granted day:2013-04-18
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