Invention Grant
US09076758B2 Rectangular capacitors for dynamic random access (DRAM) and dual-pass lithography methods to form the same
有权
用于动态随机存取(DRAM)和双路光刻方法的矩形电容器形成
- Patent Title: Rectangular capacitors for dynamic random access (DRAM) and dual-pass lithography methods to form the same
- Patent Title (中): 用于动态随机存取(DRAM)和双路光刻方法的矩形电容器形成
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Application No.: US14070893Application Date: 2013-11-04
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Publication No.: US09076758B2Publication Date: 2015-07-07
- Inventor: Nick Lindert
- Applicant: Nick Lindert
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: H01L49/02
- IPC: H01L49/02 ; H01L27/108

Abstract:
A rectangular capacitor for dynamic random access memory (DRAM) and a dual-pass lithography method to form the same are described. For example, a capacitor includes a trench disposed in a first dielectric layer disposed above a substrate. A cup-shaped metal plate is disposed along the bottom and sidewalls of the trench. A second dielectric layer is disposed on and conformal with the cup-shaped metal plate. A trench-fill metal plate is disposed on the second dielectric layer. The second dielectric layer isolates the trench-fill metal plate from the cup-shaped metal plate. The capacitor has a rectangular or near-rectangular shape from a top-down perspective.
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