Invention Grant
US09076781B2 Support device for a semiconductor chip and optoelectronic component with a carrier device and electronic component with a carrier device
有权
用于半导体芯片的支持装置和具有载体装置的光电子部件和具有载体装置的电子部件
- Patent Title: Support device for a semiconductor chip and optoelectronic component with a carrier device and electronic component with a carrier device
- Patent Title (中): 用于半导体芯片的支持装置和具有载体装置的光电子部件和具有载体装置的电子部件
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Application No.: US13810651Application Date: 2011-06-27
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Publication No.: US09076781B2Publication Date: 2015-07-07
- Inventor: Thomas Zeiler , Lai Sham Khong
- Applicant: Thomas Zeiler , Lai Sham Khong
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Agency: Slater & Marsil, L.L.P.
- Priority: DE102010027313 20100716
- International Application: PCT/EP2011/060742 WO 20110627
- International Announcement: WO2012/007271 WO 20120119
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L23/00 ; H01L33/62 ; H01S5/022 ; H01L23/31 ; H01L33/48
Abstract:
A carrier device for a semiconductor chip includes a bondable and/or solderable metallic carrier having a mounting region for the semiconductor chip and a soldering region. The carrier is at least partly covered with a covering material. A solder barrier is arranged between the soldering region and the mounting region at an interface between the carrier and the covering material. An electronic component and an optoelectronic component are furthermore specified.
Public/Granted literature
Information query
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