Invention Grant
- Patent Title: Method of manufacturing semiconductor chips
- Patent Title (中): 制造半导体芯片的方法
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Application No.: US14117463Application Date: 2012-05-18
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Publication No.: US09076859B2Publication Date: 2015-07-07
- Inventor: Atsushi Harikai
- Applicant: Atsushi Harikai
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2011-112434 20110519
- International Application: PCT/JP2012/003277 WO 20120518
- International Announcement: WO2012/157287 WO 20121122
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/78 ; H01L21/027 ; H01L21/304 ; H01L21/3065 ; H01L21/311 ; H01L21/683 ; H01J37/32
Abstract:
A method of manufacturing semiconductor chips includes removing an insulating film in a dividing region by plasma etching to a front surface. Then, roughness on a resist mask formed on the front surface is removed by plasma treatment before a BG tape is attached. After a semiconductor wafer is thinned by grinding of a backside surface thereof, the BG tape is peeled. The semiconductor wafer is divided into individual semiconductor chips by plasma etching from the front surface thereof.
Public/Granted literature
- US20140295644A1 METHOD OF MANUFACTURING SEMICONDUCTOR CHIPS Public/Granted day:2014-10-02
Information query
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