An antenna includes a first portion and a second portion soldered together. The first portion includes conductive traces applied to a first device part. The conductive traces may wrap from one side of the first device part to another side. A second device part is attached to the first device part to enclose a speaker. The second portion of the antenna comprises FPC attached to the second device part. A section of the FPC portion of the antenna extends beyond an edge of the second part and folds over onto solder applied to a section of first portion of the antenna on the first device part. The solder may be melted to attach the first portion of the antenna on the first device part to the second portion of the antenna on the second device part.