Invention Grant
- Patent Title: Connection structure for shield wire
- Patent Title (中): 屏蔽线连接结构
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Application No.: US14202267Application Date: 2014-03-10
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Publication No.: US09077169B2Publication Date: 2015-07-07
- Inventor: Shouichi Furukawa
- Applicant: Yazaki Corporation
- Applicant Address: JP Tokyo
- Assignee: Yazaki Corporation
- Current Assignee: Yazaki Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-200420 20110914
- Main IPC: H01R13/20
- IPC: H01R13/20 ; H02G15/16 ; H01R9/05 ; H01R4/18 ; H01R13/6592 ; H02G15/02
Abstract:
In a connection structure for a shield wire, a shield conductor of the shield wire is fastened tightly by a shield fastening portion for a connection thereto. The shield fastening portion is provided with a plurality of holes. A wire contact surface of the shield fastening portion has: at least an area around each of the holes and on the lower side of a wire pulling direction, as a non-knurled surface which is not knurled; and other area as a knurled surface which is knurled.
Public/Granted literature
- US20140182931A1 CONNECTION STRUCTURE FOR SHIELD WIRE Public/Granted day:2014-07-03
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