Invention Grant
- Patent Title: Substrate for electrical component and method
- Patent Title (中): 电气元件基板和方法
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Application No.: US12962270Application Date: 2010-12-07
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Publication No.: US09077344B2Publication Date: 2015-07-07
- Inventor: Carl Carley , David Brent Guard
- Applicant: Carl Carley , David Brent Guard
- Applicant Address: US CA San Jose
- Assignee: Atmel Corporation
- Current Assignee: Atmel Corporation
- Current Assignee Address: US CA San Jose
- Agency: Baker Botts LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H03K17/96 ; G06F3/044
Abstract:
Insulating substrates may be selectively removed to form electrical connections between conductive patterns on different faces of the insulating substrate or between conductive patterns on the insulating substrate and external circuits.
Public/Granted literature
- US20120138352A1 SUBSTRATE FOR ELECTRICAL COMPONENT AND METHOD Public/Granted day:2012-06-07
Information query
