Invention Grant
- Patent Title: High-frequency module
- Patent Title (中): 高频模块
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Application No.: US13782026Application Date: 2013-03-01
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Publication No.: US09077439B2Publication Date: 2015-07-07
- Inventor: Takanori Uejima
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2010-218065 20100929
- Main IPC: H04B1/48
- IPC: H04B1/48 ; H03H7/46 ; H04B1/00

Abstract:
A small high-frequency module has a structure such that a high-power signal is prevented from leaking to a switch device. On the top surface of a multilayer body, a switch device and a duplexer are mounted so as to be spaced apart from each other by a predetermined distance. An inductor and resistors connected to a circuit different from a transmission system circuit are mounted between the switch device and the duplexer. The inductor and the resistors are mounted such that external connection terminals connected to the switch device are on the switch device side and external connection terminals connected to external connection power system port electrodes of the high-frequency module are on the duplexer side.
Public/Granted literature
- US20130176916A1 HIGH-FREQUENCY MODULE Public/Granted day:2013-07-11
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