A method of fabricating a light emitting device is provided. A mother substrate including a plurality of light emitting units thereon is provided. A cover plate comprising a plurality of unit regions is provided. Each of the unit regions corresponds to one of the light emitting units. The cover plate further comprises a cutting line, a plurality of sealant regions and spacer disposing regions. A glass frit is coated on the cover plate in the sealant regions and the spacer disposing regions. A curing process is performed to solidify the glass frit in the sealant regions to form a sealant and solidify the glass frit in the spacer disposing regions to form a spacer structure. The cover plate is disposed on the mother substrate. A laser process is performed to the sealant but not the spacer structure so as to bond the cover plate and the mother substrate together.