Invention Grant
- Patent Title: Low inductance flex bond with low thermal resistance
- Patent Title (中): 低电感柔性接合,低热阻
-
Application No.: US13662659Application Date: 2012-10-29
-
Publication No.: US09078352B2Publication Date: 2015-07-07
- Inventor: Donald R. Laturell , Said E. Abdelli , Peter Kiss , James F. MacDonald , Ross S. Wilson
- Applicant: LSI Corporation
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Suiter Swantz pc llo
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K3/30 ; H05K1/02 ; H01L23/498 ; H05K3/46

Abstract:
A electronic circuit with low inductance connections is disclosed. The electronic circuit includes a ground plane and a flex circuit. The flex circuit having a first surface generally facing the ground plane and a second surface opposite to the first surface. The flex circuit also having a flexible bridge defined thereof. The electronic circuit further includes a first electronic device communicatively coupled to the second surface of the flex circuit, a second electronic device communicatively coupled to the second surface of the flex circuit, and at least one conductive trace defined on the second surface of the flex circuit and extending along the flexible bridge. One end of the at least one conductive trace is configured for receiving an outbound current from the first electronic device and another end of the at least one conductive trace is communicatively coupled to the second electronic device through a vertical interconnect access.
Public/Granted literature
- US20140118966A1 Low Inductance Flex Bond with Low Thermal Resistance Public/Granted day:2014-05-01
Information query