Invention Grant
- Patent Title: Chip-type ceramic electronic component and producing method thereof
- Patent Title (中): 片式陶瓷电子元件及其制造方法
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Application No.: US13864617Application Date: 2013-04-17
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Publication No.: US09078359B2Publication Date: 2015-07-07
- Inventor: Shinji Otani
- Applicant: MURATA MANUFACTURING CO., LTD.
- Applicant Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo-Shi, Kyoto-Fu
- Agency: Arent Fox LLP
- Priority: JP2010-233272 20101018
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/228 ; H05K1/02 ; H01G4/12 ; H01G4/232 ; H05K1/03
Abstract:
The electronic component has a resin electrode which constitutes an external electrode on a face of a ceramic base body. At least a tip portion of a resin electrode region extended around another face of the body is bonded to the ceramic base body, and further a relationship between Rz1 and Rz2 satisfies the following requirement: Rz1>Rz2, Rz1>3.3 μm, and Rz2
Public/Granted literature
- US20130220696A1 CHIP-TYPE CERAMIC ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF Public/Granted day:2013-08-29
Information query
