Embodiments of the invention provide methods and configuration for packaging multiple semiconductor ships in a semiconductor package. In one embodiment, an integrated circuit system includes a printed circuit board, a first MOSFET device disposed on a first surface of the printed circuit board, and a second MOSFET device disposed on a second surface of the printed circuit board, wherein the first MOSFET device overlaps an edge of the second MOSFET device in a direction extending through the printed circuit board.