Invention Grant
- Patent Title: Ceramic substrate, method of manufacturing ceramic substrate, and method of manufacturing power module substrate
- Patent Title (中): 陶瓷基板，陶瓷基板的制造方法以及功率模块基板的制造方法
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Application No.: US13867439Application Date: 2013-04-22
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Publication No.: US09079264B2Publication Date: 2015-07-14
- Inventor: Hiroshi Tonomura , Takeshi Kitahara , Hiroya Ishizuka , Yoshirou Kuromitsu , Yoshiyuki Nagatomo
- Applicant: MITSUBISHI MATERIALS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee: MITSUBISHI MATERIALS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Locke Lord LLP
- Priority: JP2007-288287 20071106; JP2008-072509 20080319; JP2008-271036 20081021; JP2008-271037 20081021
- Main IPC: B44C1/22
- IPC: B44C1/22 ; B23K1/20 ; H01L21/48 ; H01L23/15 ; H01L23/373 ; H01L23/40 ; H01L23/473 ; H05K3/38 ; C04B35/584 ; C04B37/02 ; H05K1/03 ; H05K3/00
Abstract:
Disclosed is a ceramic substrate including silicon in which the concentration of a silicon oxide and a silicon composite oxide in the surface thereof is less than or equal to 2.7 Atom %.
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