Invention Grant
- Patent Title: High density semiconductor memory devices
- Patent Title (中): 高密度半导体存储器件
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Application No.: US13692157Application Date: 2012-12-03
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Publication No.: US09082468B2Publication Date: 2015-07-14
- Inventor: Jaekyu Lee , Youngmin Kang , Hyunju Lee
- Applicant: Jaekyu Lee , Youngmin Kang , Hyunju Lee
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0128366 20111202
- Main IPC: G11C8/00
- IPC: G11C8/00 ; G11C8/10 ; G11C11/16 ; G11C8/08

Abstract:
High density semiconductor memory devices are provided. The device may include a cell array region including a lower structure, an upper structure, and a selection structure, the selection structure being interposed between the lower and upper structures and including word lines, and a decoding circuit controlling voltages applied to the word lines. The decoding circuit may be configured to apply a first voltage to a pair of the word lines adjacent to each other and to apply a second voltage different from the first voltage to the remaining ones of the word lines, in response to word line address information input thereto.
Public/Granted literature
- US20130141965A1 HIGH DENSITY SEMICONDUCTOR MEMORY DEVICES Public/Granted day:2013-06-06
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