Invention Grant
- Patent Title: Patterning through imprinting
- Patent Title (中): 通过印记进行图案化
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Application No.: US14102873Application Date: 2013-12-11
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Publication No.: US09082625B2Publication Date: 2015-07-14
- Inventor: Lawrence A. Clevenger , Carl J. Radens , Richard S. Wise , Yiheng Xu , John Zhang
- Applicant: International Business Machines Corporation , STMicroelectronics, Inc.
- Applicant Address: US NY Armonk US TX Coppell
- Assignee: International Business Machines Corporation,STMICROELECTRONICS, Inc.
- Current Assignee: International Business Machines Corporation,STMICROELECTRONICS, Inc.
- Current Assignee Address: US NY Armonk US TX Coppell
- Agent Yuanmin Cai
- Main IPC: B44C1/22
- IPC: B44C1/22 ; H01L21/033 ; H01L21/306 ; H01L21/02

Abstract:
Embodiments of present invention provide a method of forming device pattern. The method includes defining a device pattern to be created in a device layer; forming a sacrificial layer on top of the device layer; identifying an imprinting mold that, at a position along a height thereof, has a horizontal cross-sectional shape that represents the device pattern; pushing the imprinting mold uniformly into the sacrificial layer until at least the position of the imprinting mold reaches a level inside the sacrificial layer that is being pushed by the imprinting mold; removing the imprinting mold away from the sacrificial layer; forming a hard mask in recesses created by the imprinting mold in the sacrificial layer, the hard mask has a pattern representing the device pattern; and transferring the pattern of the hard mask into underneath the device layer.
Public/Granted literature
- US20150162194A1 PATTERNING THROUGH IMPRINTING Public/Granted day:2015-06-11
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