Invention Grant
US09082629B2 Semiconductor device and method for forming a semiconductor device
有权
用于形成半导体器件的半导体器件和方法
- Patent Title: Semiconductor device and method for forming a semiconductor device
- Patent Title (中): 用于形成半导体器件的半导体器件和方法
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Application No.: US14040867Application Date: 2013-09-30
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Publication No.: US09082629B2Publication Date: 2015-07-14
- Inventor: Johannes Georg Laven , Hans-Joachim Schulze , Roman Baburske
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/06 ; H01L29/739

Abstract:
A semiconductor device includes an insulated gate bipolar transistor (IGBT) arrangement. The IGBT arrangement includes a carrier confinement reduction region laterally arranged between a cell region and a sensitive region. The IGBT arrangement is configured or formed so that the cell region has a first average density of free charge carriers in an on-state of the IGBT arrangement, the carrier confinement reduction region has a second average density of free charge carriers in the on-state of the IGBT arrangement and the sensitive region has a third average density of free charge carriers in the on-state of the IGBT arrangement. The first average density of free charge carriers is larger than the second average density of free charge carriers and the second average density of free charge carriers is larger than the third average density of free charge carriers.
Public/Granted literature
- US20150091051A1 Semiconductor Device and Method for Forming a Semiconductor Device Public/Granted day:2015-04-02
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