Invention Grant
US09082714B2 Use of etch process post wordline definition to improve data retention in a flash memory device
有权
使用蚀刻处理后字幕定义来改善闪存设备中的数据保留
- Patent Title: Use of etch process post wordline definition to improve data retention in a flash memory device
- Patent Title (中): 使用蚀刻处理后字幕定义来改善闪存设备中的数据保留
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Application No.: US13993444Application Date: 2011-09-22
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Publication No.: US09082714B2Publication Date: 2015-07-14
- Inventor: Randy J. Koval , Max F. Hineman , Ronald A. Weimer , Vinayak K. Shamanna , Thomas M. Graettinger , William R. Kueber , Christopher Larsen , Alex J. Schrinsky
- Applicant: Randy J. Koval , Max F. Hineman , Ronald A. Weimer , Vinayak K. Shamanna , Thomas M. Graettinger , William R. Kueber , Christopher Larsen , Alex J. Schrinsky
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- International Application: PCT/US2011/052850 WO 20110922
- International Announcement: WO2013/043184 WO 20130328
- Main IPC: H01L21/76
- IPC: H01L21/76 ; H01L21/306 ; H01L29/51 ; H01L29/788 ; H01L29/792 ; H01L27/115

Abstract:
Embodiments of the present disclosure are directed towards use of an etch process post wordline definition to improve data retention in a flash memory device. In one embodiment, a method includes forming a plurality of wordline structures on a substrate, wherein individual wordline structures of the plurality of wordline structures include a control gate having an electrically conductive material and a cap having an electrically insulative material formed on the control gate, depositing an electrically insulative material to form a liner on a surface of the individual wordline structures, and etching the liner to remove at least a portion of the liner. Other embodiments may be described and/or claimed.
Public/Granted literature
- US20130264628A1 USE OF ETCH PROCESS POST WORDLINE DEFINITION TO IMPROVE DATA RETENTION IN A FLASH MEMORY DEVICE Public/Granted day:2013-10-10
Information query
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