Invention Grant
US09082766B2 Method to enhance reliability of through mold via TMVA part on part POP devices
有权
通过部件POP设备上的TMVA部件提高通过模具的可靠性的方法
- Patent Title: Method to enhance reliability of through mold via TMVA part on part POP devices
- Patent Title (中): 通过部件POP设备上的TMVA部件提高通过模具的可靠性的方法
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Application No.: US14093544Application Date: 2013-12-02
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Publication No.: US09082766B2Publication Date: 2015-07-14
- Inventor: Vahid Goudarzi
- Applicant: MOTOROLA MOBILITY LLC
- Applicant Address: US CA Mountain View
- Assignee: Google Technology Holdings LLC
- Current Assignee: Google Technology Holdings LLC
- Current Assignee Address: US CA Mountain View
- Agency: Leydig, Voit & Mayer, LTD.
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/498 ; H01L23/00 ; H01L23/31 ; H01L25/10 ; H01L25/00
Abstract:
A Through Mold Via (TMV) Integrated Circuit (IC) package is provided as a bottom IC package for a TMV Package on Package (POP) configuration. The TMV IC package has an overmold top portion having a substantially flat surface and spacer or standoff features extending upward from the flat surface. The spacer or standoff features are configured to abut the bottom surface of the top POP package during softer reflow in order to maintain a gap of predetermined height between the top and bottom IC packages.
Public/Granted literature
- US20150041979A1 METHOD TO ENHANCE RELIABILITY OF THROUGH MOLD VIA TMVA PART ON PART POP DEVICES Public/Granted day:2015-02-12
Information query
IPC分类:
