Invention Grant
- Patent Title: High-frequency circuit board
- Patent Title (中): 高频电路板
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Application No.: US13616174Application Date: 2012-09-14
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Publication No.: US09082785B2Publication Date: 2015-07-14
- Inventor: Yoshiyuki Ishida , Sadao Matsushima , Toshihide Fukuchi
- Applicant: Yoshiyuki Ishida , Sadao Matsushima , Toshihide Fukuchi
- Applicant Address: JP Tokyo JP Inukami-gun
- Assignee: FURUKAWA ELECTRIC CO., LTD.,FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Current Assignee: FURUKAWA ELECTRIC CO., LTD.,FURUKAWA AUTOMOTIVE SYSTEMS INC.
- Current Assignee Address: JP Tokyo JP Inukami-gun
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-080463 20100331
- Main IPC: H01P3/08
- IPC: H01P3/08 ; H01L23/66 ; H01L23/552 ; H01L23/64 ; H05K1/02 ; H05K1/11 ; H01P1/00 ; H01L23/498

Abstract:
A high-frequency circuit board capable of easily forming a bias line whose resonance frequency is sufficiently separated from operating frequency is provided. On a high-frequency circuit board 100, by electrically connecting a bias line 11 to a high-frequency circuit 10 using blind via holes 106 and 107, it is possible to limit the route that has a possibility of producing resonance only to the bias line connecting the ends 106a and 107a of the blind via holes 106 and 107 to the bias line 11. By adjusting the route length from the end 106a to the end 107a, it is possible to prevent production of resonance in the vicinity of the operating frequency.
Public/Granted literature
- US20130000956A1 HIGH-FREQUENCY CIRCUIT BOARD Public/Granted day:2013-01-03
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