Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US14359761Application Date: 2011-11-22
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Publication No.: US09082842B2Publication Date: 2015-07-14
- Inventor: Yasuhiro Hirabayashi , Masaru Senoo
- Applicant: Yasuhiro Hirabayashi , Masaru Senoo
- Applicant Address: JP Toyota-Shi
- Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
- Current Assignee Address: JP Toyota-Shi
- Agency: Kenyon & Kenyon LLP
- International Application: PCT/JP2011/076942 WO 20111122
- International Announcement: WO2013/076820 WO 20130530
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L29/78 ; H01L29/739 ; H01L29/40 ; H01L29/423 ; H01L29/06

Abstract:
A semiconductor device disclosed herein includes an insulated gate, a main and a sub trench conductors. The main and sub trench conductors are formed in the cell region, and have a conductor that is covered with an insulation film and fills a trench extending in a first direction. The sub trench is located, with respect to the main trench conductor, in a second direction perpendicularly crossing the first direction and extending from the cell region side to the non-cell region. Length of the sub trench conductor in the first direction is shorter than a length of the insulated gate in the first direction. Distance between the main and sub trench conductors is shorter than a distance between the main trench conductor and the insulated gate. At least a part of the sub trench conductor reaches a position deeper than a boundary between the first and second semiconductor regions.
Public/Granted literature
- US20140291757A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-10-02
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