Invention Grant
- Patent Title: Semiconductor optical emitting device with metallized sidewalls
- Patent Title (中): 具有金属化侧壁的半导体发光器件
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Application No.: US13920817Application Date: 2013-06-18
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Publication No.: US09082926B2Publication Date: 2015-07-14
- Inventor: Joseph M. Freund , David L. Dreifus
- Applicant: LSI Corporation
- Applicant Address: SG Singapore
- Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Suiter Swantz pc llo
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/24 ; H01L33/12 ; H01L33/46 ; H01L33/20

Abstract:
A semiconductor optical emitting device comprises an at least partially transparent substrate, an active semiconductor structure, a dielectric layer and a metal layer. The substrate comprises a first surface, a second surface and at least one sidewall. The active semiconductor structure comprises a first surface, a second surface and at least one sidewall, the first surface of the active semiconductor structure facing the second surface of the substrate. The dielectric layer surrounds at least a portion of the at least one sidewall of the active semiconductor structure. The metal layer surrounds at least a portion of the dielectric layer. The at least one sidewall of the active semiconductor structure is tapered and a first portion of the at least one sidewall of the active semiconductor structure has a different tapering than a second portion of the at least one sidewall of the active semiconductor structure.
Public/Granted literature
- US20140367717A1 SEMICONDUCTOR OPTICAL EMITTING DEVICE WITH METALLIZED SIDEWALLS Public/Granted day:2014-12-18
Information query
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