Invention Grant
- Patent Title: Wiring module
- Patent Title (中): 接线模块
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Application No.: US13978070Application Date: 2012-02-21
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Publication No.: US09083095B2Publication Date: 2015-07-14
- Inventor: Shinichi Takase , Osamu Nakayama , Ryoya Okamoto , Mitsutoshi Morita , Kensaku Takata , Hiroki Hirai , Katsutoshi Saijo , Hiroomi Hiramitsu , Takeshi Aizawa
- Applicant: Shinichi Takase , Osamu Nakayama , Ryoya Okamoto , Mitsutoshi Morita , Kensaku Takata , Hiroki Hirai , Katsutoshi Saijo , Hiroomi Hiramitsu , Takeshi Aizawa
- Applicant Address: JP Mie JP Mie JP Osaka
- Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee: AUTONETWORKS TECHNOLOGIES, LTD.,SUMITOMO WIRING SYSTEMS, LTD.,SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Current Assignee Address: JP Mie JP Mie JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-061006 20110318
- International Application: PCT/JP2012/054073 WO 20120221
- International Announcement: WO2012/127962 WO 20120927
- Main IPC: H01M2/20
- IPC: H01M2/20 ; H01M2/10 ; H01M2/30 ; H01R11/12 ; H02B1/21

Abstract:
A wiring module attached to a plurality of electric cells having electrode terminals including positive electrodes and negative electrodes has a plurality of bus bars having pairs of through-holes respectively connected to the positive electrodes and the negative electrodes of the electric cells and bus bar insulating members each held by the adjacent bus bars. Of the plurality of bus bar insulating members, a first bus bar insulating member and a second bus bar insulating member are connected with each other by the bus bar.
Public/Granted literature
- US20130280959A1 WIRING MODULE Public/Granted day:2013-10-24
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