A socket for electronic components configured to connect each electrode terminal of an electronic component to a wiring of a wiring board with a shield member having electrical conductivity and multiple openings being disposed on the wiring board, with a contact unit configured to electrically conduct the electrode terminal of the electronic component and the wiring of the wiring board PB being disposed in the openings, and with the contact unit including a ground contacting portion configured to electrically conduct with the shield member, and when the contact unit is for grounding, grounding is performed by the ground contacting portion and the shield member being brought into contact and electrically conducting.